高温可脱结之黏着剂;HIGH TEMPERATURE DEBONDABLE ADHESIVE

摘要

本发明系关于一种可脱结之黏着剂组合物，其包含(A)1,3,5,7-四乙烯基-1,3,5,7-四甲基环四矽氧烷上之乙烯基与具有末端Si-H氢的矽烷或矽氧烷上之末端Si-H氢之间的反应之氢矽化反应产物，(B)用于该氢矽化反应产物之交联剂，及(C)金属催化剂及/或自由基引发剂。在其他实施例中，本发明系关于一种基板与用于该基板之载体的总成，其中该可脱结之黏着剂组合物系安置在该等基板之间，及一种用于制造该总成之方法。该可脱结之黏着剂组合物在300℃或更高的温度下维持其黏着力且在室温下可以低于5N/25mm之力机械脱结。 A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300℃