COMPOSITION FOR FORMING CONDUCTIVE FILM AND METHOD FOR PRODUCING CONDUCTIVE FILM USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming a conductive film capable of forming a conductive film which exhibits excellent conductivity and has excellent toughness.SOLUTION: There are provided a composition for forming a conductive film which comprises: copper composite particles (A) in which copper fine particles (a2) having an average particle diameter of secondary particles of 10 to 200 nm are adhered on the surface of copper particles (a1) having an average particle diameter of primary particles of 0.20 μm or more and less than 1.0 μm; a thermosetting resin (B); and a solvent (C), wherein the ratio of the total mass of the copper fine particles (a2) to the total mass of the copper particles (a1) in the copper composite particles (A) is 55 to 120 mass%.