| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board which is essentially based on a conventional organic material (for example, epoxy resin), having pads of a pitch being tight capable of mounting a semiconductor element.SOLUTION: In a coupling type printed wiring board, a wiring film is bonded to a portion of one outermost insulating layer of a multilayer printed wiring board. On a semiconductor element mounting surface of the wiring film, pads in tight pitch used for electrically and mutually connecting a first semiconductor element and a second semiconductor element are formed. On a semiconductor element mounting surface of the multilayer printed wiring board, pads in rough pitch used for electrically connecting the first semiconductor element or the second semiconductor element are formed.</p> |
