切晶带一体型晶圆背面保护膜;DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM

摘要

本发明提供一种切晶带一体型晶圆背面保护膜，其包括：一切晶带，其包括一基底材料及一形成于该基底材料上之压敏黏接层；及一晶圆背面保护膜，其系形成于该切晶带之该压敏黏接层上，其中该晶圆背面保护膜经着色。该有色晶圆背面保护膜具有一雷射标记能力为较佳。该切晶带一体型晶圆背面保护膜可适用于一覆晶安装半导体器件。; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.