| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounting substrate that can improve heat dissipation and suppress occurrence of cracks in an insulating base.SOLUTION: A semiconductor element mounting substrate comprises: an insulating substrate 2 having a mounting part 2a of a semiconductor element 6 on one principal surface; a pair of plate-like connection electrodes 3 which are embedded into the insulating substrate 2 and whose surface is exposed on the one principal surface of the insulating substrate 2, and which are provided so as to overlap the mounting part 2a and face each other and connected to an electrode 6a of the semiconductor element 6; and an external connection terminal 5 connected to the connection electrodes 3. Side surfaces 3a of the pair of connection electrodes 3 face each other in the insulating substrate 2, and provided so that the distance between the side surfaces 3a on the side of one principal surface is larger than that on the side of the other principal surface. |
