| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition and a production method of the composition allowing formation of a cured film that ensures PCT (pressure cooker test) durability, HAST (highly accelerated temperature and pressure stress test) durability, electroless gold plating durability, and thermal shock resistance, which are critical as a solder resist for a semiconductor package, and that has excellent flexibility, and to provide a dry film and a cured product of the composition, and a printed wiring board on which a cured film of a solder resist or the like is formed by using the above composition or the cured product.SOLUTION: The photocurable thermosetting resin composition comprises (1) a high heat-resistant resin having an unsaturated double bond and a carboxyl group, (2) a photopolymerization initiator, (3) a reactive diluent having an unsaturated double bond, (4) a thermosetting component, (5) a filler, (6) an ion adsorbent, and (7) at least one elastomer selected from a core-shell particle type elastomer and a silicone elastomer. |
