发明名称 积层体及其处理方法暨可挠性装置之制造方法;LAMINATED PRODUCT, TREATMENT METHOD THEREOF AND PRODUCTION METHOD OF FLEXIBLE DEVICE
摘要 本发明之目的在于提供一种积层体,其聚醯亚胺系薄膜与无机基板之密接性良好,且可容易地于短时间内将聚醯亚胺系薄膜自无机基板剥离。本发明提供一种积层体,其系具有无机基板及形成于该无机基板上之聚醯亚胺系薄膜者,且具有以下之特征:(1)聚醯亚胺系薄膜系包含聚醯亚胺系树脂层A及聚醯亚胺系树脂层B之积层薄膜,聚醯亚胺系树脂层A全面与上述无机基板相接,且形成于聚醯亚胺系树脂层A之表面之聚醯亚胺系树脂层B之一部分与上述无机基板相接;(2)聚醯亚胺系树脂层A与上述无机基板之黏着强度为2N/cm以下;(3)聚醯亚胺系树脂层B与上述无机基板之黏着强度超过2N/cm;及(4)与上述无机基板相接之聚醯亚胺系树脂层B可藉由吸湿处理而自上述无机基板剥离。; (2) a bonding strength between the polyimide-based resin layer A and the inorganic substrate is 2 N/cm or less; (3) a bonding strength between the polyimide-based resin layer B and the inorganic substrate is more than 2 N/cm; and (4) the polyimide-based resin layer B in contact with the inorganic substrate becomes possible to be debonded from the inorganic substrate by a humidifying treatment.
申请公布号 TW201509682 申请公布日期 2015.03.16
申请号 TW103125251 申请日期 2014.07.24
申请人 尤尼吉可股份有限公司 UNITIKA LTD. 发明人 繁田朗 SHIGETA, AKIRA;吉田猛 YOSHIDA, TAKESHI;山田佑己 YAMADA, YUKI;森北达弥 MORIKITA, TATSUYA;山田宗纪 YAMADA, MUNENORI;江口寿史朗 EGUCHI, JUSHIRO;细田雅弘 HOSODA, MASAHIRO;越后良彰 ECHIGO, YOSHIAKI
分类号 B32B7/00(2006.01) 主分类号 B32B7/00(2006.01)
代理机构 代理人 赖经臣宿希成
主权项
地址 日本 JP