| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus which manufactures a bonded substrate with high productivity, and to provide a manufacturing method.SOLUTION: A manufacturing apparatus 102 according to one embodiment of the invention includes: a first cartridge 20 which includes a contact part 22 and a biasing part 23 and holds a silicon wafer 12; a second cartridge 30 which includes a contact part 32 and a biasing part 33 and holds a glass substrate 13; a stage 40 including a contact part 42 and a biasing part 43; a holding jig 50 which includes a contact part 52 and a biasing part 53 and holds the second cartridge 30 above the stage 40; a drive mechanism 85 which moves the holding jig 50 relative to the stage 40 so that the silicon wafer 12 and the glass substrate 13 come close to each other; a support pillar 86 which guides relative movement by the drive mechanism 85; and a chamber 80 which houses the stage 40, the holding jig 50, and the support pillar 86. |
