| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer processing method that can suppress a bevelling from cracking at once.SOLUTION: A wafer processing method comprises: a holding step for holding a wafer on a holding surface 11a of a chuck table 11 while exposing a surface Wa of the wafer; a cutting step for cutting an outer peripheral part of the wafer by a cutting depth of a predetermined thickness or more with a cutting blade 12a; a bevelling removal step for cutting the outer peripheral part of the wafer with the cutting blade 12a while rotating the chuck table 11 holding the wafer, and removing the bevelling Wc by the cutting depth of the predetermined thickness or more; a protective member arrangement step for arranging a protective member on the surface Wa of the wafer; and a grinding step for grinding a rear surface Wb of the wafer to reduce thickness of the wafer to a predetermined thickness. A depth of a cutting groove Cg formed in the bevelling removal step is uneven along the whole outer periphery of the wafer.</p> |
