树脂组成物、硬化膜及其制造方法、以及电子零件;RESIN COMPOSITION, CURED FILM AND MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC COMPONENT

摘要

本发明是一种树脂组成物，其是含有(a)聚醯亚胺前驱物、(b)烷氧基矽烷化合物、(c)光起始剂及(d)溶剂的树脂组成物，且所述(a)成分含有下述式(1)所表示的结构单元，所述(b)成分含有下述式(4-1)所表示的化合物及下述式(4-2)所表示的化合物中的1种以上，所述(c)成分含有肟酯化合物。;The invention provides a resin composition, which is a resin composition including: (a) a polyimide precursor, (b) an alkoxysilane compound, (c) a photoinitiator, and (d) a solvent. The ingredient (a) includes a structural unit represented by the following formula (1), the ingredient (b) includes one or more compounds represented by the following formulae (4-1) and (4-2), and the ingredient (c) includes an oxime ester compound.