MULTI-WIRE PROCESSING METHOD AND MULTI-WIRE PROCESSING DEVICE CAPABLE OF REDUCING WARPAGE

摘要

PROBLEM TO BE SOLVED: To provide a multi-wire processing method and a multi-wire processing device capable of slicing a processing object industrially simply and easily regardless of warpage generation mechanism and capable of reducing the warpage of a cut-out plate-like body as much as possible.SOLUTION: In a multi-wire processing method and a multi-wire processing device, a processing object is cut by a multi-wire saw and is processed into a plurality of plate-like bodies. Assuming that a running direction of a saw wire is an X direction, a saw wire cutting direction in which the saw wire cuts the processing object is a Z direction, and a direction vertical to a XZ plane is a Y direction, the processing object is displaced in such a direction as to reduce a Y direction displacement amount in accordance with displacement amount change information of a Y direction displacement component of distortion of the saw wire generated during multi-wire processing.