| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board which is essentially based on a conventional organic material (for example, epoxy resin), having pads of a pitch being tight capable of mounting a semiconductor element.SOLUTION: In a coupling type printed wiring board, a wiring film is bonded to one main surface of a multilayer printed wiring board. In the wiring film, first wiring for connecting between semiconductor elements mounted on the coupling type printed wiring board and second wiring for connecting between respective semiconductor elements and the multilayer printed wiring board, are formed in a mixed manner.</p> |
