环氧树脂组成物、预浸体、纤维强化复合材料、电子装置用壳体;EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, HOUSING FOR ELECTRONIC DEVICE

摘要

本发明提供一种环氧树脂组成物、预浸体、纤维强化复合材料、电子装置用壳体，此环氧树脂组成物可以得到硬化性优异、具有优异的阻燃性且耐热性优异的纤维强化复合材料。环氧树脂组成物包括：(A)成分：磷化合物。(B)成分：环氧树脂，其1分子中具有3个以上的环氧基，此环氧树脂不相当于上述(A)成分、并且不含上述(A)成分。(C)成分：环氧树脂硬化剂，其分子中不具有尿素结构。(D)成分：下述式(a)所示的二甲基脲化合物。;The present invention provides an epoxy resin composition, a prepreg, a fiber-reinforced composite material with use of the prepreg, and a housing for electronic device, are capable of providing a fiber-reinforced composite material having superior hardenability, superior flame resistance as well as superior heat resistance. An epoxy resin composition comprising: a component (A), which is a phosphorous compound; a component (B), which is an epoxy resin having more than 3 epoxy groups in a molecule, wherein the component (B) does not corresponds to the component (A) and does not include the component (A); a component (C), which is an epoxy resin hardening agent without urea scture in a molecule; and a component (D), which is a dimethylurea compound represented by the following formula (a):