| 摘要 |
<p>The present invention relates to a semiconductor package of a double-sided mounting type and, more particularly, to a semiconductor package of a double-sided mounting type which includes a first substrate which mounts electronic devices on both sides thereof, a second substrate which is in contact with the lower side of the first substrate, includes a hollow part inside, and receives the electronic device mounted on the lower side of the first substrate in the hollow part, and an insulation layer which is closely attached between the first substrate and the second substrate. A protrusion or a groove is formed on the first substrate.</p> |
