| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of stably operating an electronic component.SOLUTION: A method for manufacturing a wiring board (A) is provided, wherein the wiring board has a through-hole 1a that accommodates an electronic component D or faces the electronic component D, formed between major surfaces of an insulating substrate 1 having a wiring conductor 2 on at least one major surface, and the wiring board includes a solder resist layer 3 that is applied on both major surfaces of the insulating substrate 1 and on an inner wall of the through-hole 1a so as to partially expose the wiring conductor 2 to the outside and to cover the inner wall, and that has a penetration opening 3c at the position of the through-hole 1a. The method includes: a step of preparing the insulating substrate 1 in which the wiring conductor 2 is formed and the through-hole 1a is formed; a step of applying a photosensitive resin film 3F for the solder resist on one major surface of the insulating substrate 1; a step of applying a photosensitive resin paste 3P for the solder resist on the other major surface of the insulating substrate 1; and forming the solder resist layer 3 that partially exposes the wiring conductor 2 to the outside, covers the inner wall and has the penetration opening 3c at the position of the through-hole 1a. |
