热固性树脂组合物、成形材料、光半导体元件搭载用封装及其制造方法、以及光半导体装置;THERMOSETTING RESIN COMPOSITION, MOLDING MATERIAL, PACKAGE FOR CARRYING OPTICAL SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREOF AND OPTICAL SEMICONDUCTOR DEVICE

摘要

本发明的目的在于提供一种树脂成形体与导线电极的接着性良好且可靠性优良的光半导体元件搭载用封装及使用此封装的光半导体装置。为达成该目的，所提供之光半导体元件搭载用封装及使用此封装的光半导体装置之特征在于：光半导体元件搭载用封装具有作为光半导体元件搭载区域的凹部，藉由使树脂成形体与至少一对正及负的导线电极一体化而构成。其中，上述树脂成形体由热固性光反射用树脂组合物构成且至少形成上述凹部侧面。上述一对正及负的导线电极呈对向配置以形成上述凹部底面的一部分，且上述树脂成形体与上述导线电极的接合面无间隙。; and the package for carrying the optical semiconductor element also has a resin molding body and at least one pair of positive and negative lead electrodes, which are combined to one. The resin molding body is formed by a thermosetting resin composition for light reflection and forms at least one side surface of the concave portion. The at least one pair of positive and negative lead electrodes are disposed opposite to each other to form a portion of a bottom surface of the concave portion. A conjunction surface between the resin molding body and the lead electrodes has no interval.