| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting an image sensor in which peeling of an insulating substrate and a metallic plate can be suppressed, and to provide an imaging apparatus.SOLUTION: A substrate 1 for mounting an image sensor includes an insulating substrate 2 having an image sensor mounting part 11, and a first side 2a and second side 2b, and a metallic plate 4 provided on the principal surface of the mounting part 11, and having a first outside region 4a located on the outside of the first side 2a in the top view. The metallic plate 4 has a through hole 6 or a notch in the first outside region 4a, but not having a through hole 6 or a notch on the outside of the second side 2b. The width of a bonding region 5a of the insulating substrate 2 and insulating substrate 2 on the first side 2a is larger than the width of a bonding region 5a of the insulating substrate 2 and metallic plate 4 on the second side 2b. |
