ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic component embedded substrate capable of reducing a warpage phenomenon and minimizing unnecessary wiring.SOLUTION: An electronic component embedded substrate 100 includes: an electronic component 10 comprising a first surface provided with a first external terminal 11 thereon and a second surface opposite to the first surface and made of an insulating material; a first wiring layer L1 provided on the first surface and comprising a first insulating portion and first wiring electrically connected to the first external terminal 11; and a second wiring layer L2 provided on the second surface and comprising second wiring and a second insulating portion. At least one of the number of layers and wiring density of the first wiring layer L1 is greater than at least one of the number of layers and wiring density of the second wiring layer L2, and the first insulating portion is made of a material having a lower coefficient of thermal expansion than the second insulating portion.