| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin composition usable as a sealing material for semiconductors in a high temperature environment of 200°C or higher.SOLUTION: The epoxy resin as a raw material of an epoxy resin composition in this invention has a cyclic siloxane structure with a ring structure made of 3 or more -Si-O-, and, in the 3 or more -Si-O-, each of at least two Si is coupled with a structure X represented by the following chemical formula (in the structure X, M denotes a mesogenic group including at least one benzene ring).</p> |
