| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solder composition having superior solder wettability.SOLUTION: A solder composition contains 70 to 92 mass% of lead-free solder powder having a melting point of 240°C or less (A) and 8 to 30 mass% of thermo-setting resin composition which contains a thermosetting resin (B), an activator (C) and a curing agent (D). Therein, the activator (C) contains 4-7C dicarboxylic acid (C1) and an organic acid amine salt (C2) which is a salt of amine and organic acid.</p> |
