| 摘要 |
本发明系关于层状结构之制造，其包含以下方法步骤：i)用至少包含银奈米线及溶剂之组成物涂布基板；ii)至少部分移除该溶剂，从而获得涂布有导电层之基板，该导电层至少包含该等银奈米线；iii)使该导电层之所选区域与蚀刻组成物接触，从而降低该导电层在此等所选区域中之导电性，其中该蚀刻组成物包含能够释放氯、溴或碘之有机化合物，含有次氯酸根之化合物，含有次溴酸根之化合物，或此等化合物中之至少两者之混合物。;本发明亦关于可藉由此方法获得之层状结构、层状结构、层状结构之用途、电子组件及有机化合物之用途。; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds. ;The invention also relates to a layer structure obtainable by this method, a layer structure, the use of a layer structure, an electronic component and the use of an organic compound. |
