CHEMICAL MECHANICAL POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide chemical mechanical polishing pads that exhibit an appropriate balance of properties that provides a degree of planarization while minimizing defect formation.SOLUTION: A chemical mechanical polishing pad comprises: a polishing layer 20; a rigid layer 25; and a hot melt adhesive 23 bonding the polishing layer to the rigid layer. The polishing layer exhibits: a specific gravity greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.