THERMOELECTRIC MODULE AND COOLING APPARATUS COMPRISING SAME

摘要

Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.