DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

　Provided is a die bond material for optical semiconductor element containing a partially hydrosilylated compound obtained by reacting: (a) a compound having at least two carbon-carbon double bonds in the molecule; with (b) a cyclic siloxane having hydrogen atoms which are bonded to two or more silica atoms within the molecule. Also provided is an optical semiconductor device equipped with an adhesive layer made from such a die bond material for optical semiconductor element.