| 摘要 |
<p>Disclosed is a method for manufacturing a semiconductor-wafer-processing tape (10) intended to reduce the amount of adhesive used in an adhesive layer, simplify manufacturing procedures (in particular, minimizing manpower needed for cutting the adhesive layer), and improve the end-product quality. The method includes a printing step for forming an adhesive layer (12) on a supporting film (11) by making a die-bonding adhesive substantially the same size as or larger than a semiconductor wafer and performing screen printing or gravure printing, and a drying step for drying the adhesive layer (12).</p> |
