EMBEDDED ELECTRONIC PACKAGING AND ASSOCIATED METHODS

摘要

An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.

主权项

1. An electronic package comprising:
a semiconductor die; a plurality of conductive pillars extending outwardly from said semiconductor die; a liquid crystal polymer (LCP) body surrounding said semiconductor die and having a plurality of openings therein receiving respective ones of said plurality of conductive pillars while leaving respective gaps adjacent tops of the conductive pillars; a first interconnect layer on said LCP body; and a plurality of conductive bodies in the respective gaps to connect said plurality of conductive pillars to said first interconnect layer.