| 发明名称 |
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY |
| 摘要 |
A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation. |
| 申请公布号 |
US2015069588(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414279601 |
申请日期 |
2014.05.16 |
| 申请人 |
National Institute of Aerospace Associates ;U.S.A., as represented by the Administrator of the National Aeronautics and Space Administration |
发明人 |
Kang Jin Ho;Sauti Godfrey;Park Cheol;Gibbons Luke;Thibeault Sheila A.;Lowther Sharon E.;Bryant Robert G. |
| 分类号 |
H01L23/556;H01L21/56;H01L23/31;H01L21/311;H01L23/00;H01L23/552;H01L21/78 |
主分类号 |
H01L23/556 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for forming a hardened chip package for a circuit chip, comprising:
providing a circuit chip; coating the circuit chip with an alpha particle shielding material; coating the alpha particle shielding material with a high energy particle shielding composite material; coating the high energy particle shielding composite material with a high energy electromagnetic (EM) wave shielding composite material wherein a coated circuit chip is formed; and encapsulating the coated circuit chip, the alpha particle shielding material, the high energy particle shielding composite material and the high energy EM wave shielding composite material with a molding compound. |
| 地址 |
Hampton VA US |
