PACKAGE-ON-PACKAGE SEMICONDUCTOR SENSOR DEVICE

摘要

A semiconductor sensor device has a MCU die and an acceleration-sensing die mounted on a die paddle of a lead frame. The MCU die is connected to leads of the lead frame with first bond wires and the acceleration-sensing die is connected to the MCU die with second bond wires. An interposer is flip-chip mounted on a top surface of the MCU die. The MCU die, acceleration-sensing die and a portion of the interposer are covered with a molding compound. A pre-packaged pressure sensor is flip-chip mounted on a top, exposed surface of the interposer. The interposer provides electrical connection between the pre-packaged pressure sensor and the MCU die.

主权项

1. A semiconductor sensor device, comprising:
a substrate; a micro-controller unit (MCU) die mounted on the substrate; an interposer mounted on the MCU die; a first molding compound encapsulating the MCU die and a first portion of the interposer, wherein a second portion of the interposer is exposed; and a pre-packaged pressure sensor mounted on the exposed, second portion of the interposer, wherein the interposer provides electrical interconnection between the MCU die and the pre-packaged pressure sensor.