| 发明名称 |
LIGHT-EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING SAME |
| 摘要 |
A light-emitting device module includes a substrate and a light-emitting device disposed on the substrate. The light-emitting device may have a first pad and a second pad disposed thereon. A coating layer may cover the light-emitting device. The coating layer has a first via hole and a second via hole configured to respectively expose the first pad and the second pad therethrough. Wirings configured to be electrically connected to the first pad and the second pad through the first via hole and the second via hole are disposed on the coating layer. |
| 申请公布号 |
US2015069425(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414188747 |
申请日期 |
2014.02.25 |
| 申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
Kim Dong-Hwan;Kwon Yong-Hoon;Kim Hyuk-Hwan;Nam Seok-Hyun |
| 分类号 |
H01L33/40;H01L27/15;H01L33/52 |
主分类号 |
H01L33/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting device module, comprising:
a substrate; a light-emitting device disposed on the substrate, wherein the light-emitting device has a first pad and a second pad disposed thereon; a coating layer covering the light-emitting device, wherein the coating layer has a first via hole and a second via hole configured to respectively expose the first pad and the second pad therethrough; and wirings configured to be electrically connected to the first pad and the second pad through the first via hole and the second via hole, wherein the wirings are disposed on the coating layer. |
| 地址 |
YONGIN-CITY KR |
