| 摘要 |
According to an embodiment, a semiconductor apparatus is provided with a substrate on which are formed first contact parts, and a lower portion shield plate using magnetic material, which is disposed upon the substrate so as to avoid the first contact parts. In addition, the semiconductor apparatus is provided with a semiconductor chip comprising second contact parts which are disposed upon the lower portion shield plate and which are electrically connected to the first contact parts, and connecting material which electrically connects the first contact parts with the second contact parts. Furthermore, a semiconductor storage apparatus is provided with an upper portion shield plate using magnetic material which is disposed upon the semiconductor chip so as to avoid the second contact parts and the connecting material. For the lower portion shield plate and/or the upper portion shield plate, an edge portion is bent toward the other shield plate, and the tip of the first-mentioned shield plate comprises a sidewall portion connected to the other shield plate. |
