| 摘要 |
<p>The present invention relates to a circuit board machining process, comprising the steps of: fixing and positioning a copper-clad copper foil requiring a length, width and thickness onto a machining platform; arranging the copper foil according to a designed circuit, utilizing laser to machine the copper foil, separating the circuit copper foil from the undesired copper foil via physical machining, and coating copper-clad glue onto a position on a circuit board having a corresponding circuit according to the designed circuit document; positioning and pressure-welding a circuit board substrate on the copper foil, and when the circuit board substrate is lifted, the circuit copper foil circuit adhering to the substrate; and finally forming the circuit board having the circuit by hot-pressing and fixing the circuit board substrate and the copper foil circuit. Compared with the prior art, the present invention fundamentally solves the pollution problem of a circuit etching process, and can be considered a revolutionary improvement in the circuit board industry. Furthermore, the present invention eliminates the process step of recycling and re-processing etching liquid and the step of coating the copper foil on a substrate, simplifying the process, and reducing costs.</p> |
