发明名称 |
RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF |
摘要 |
The present disclosure provides a semiconductor structure which includes a conductive layer and a resistance configurable structure over the conductive layer. The resistance configurable structure includes a first electrode, a resistance configurable layer over the first electrode, and a second electrode over the resistance configurable layer. The first electrode has a first sidewall, a second sidewall, and a bottom surface on the conductive layer. A joint between the first sidewall and the second sidewall includes an electric field enhancement structure. The present disclosure also provides a method for manufacturing the above semiconductor structure, including patterning a hard mask on a conductive layer; forming a spacer around the hard mask; removing at least a portion of the hard mask; forming a conforming resistance configurable layer on the spacer; and forming a second conductive layer on the conforming resistance configurable layer. |
申请公布号 |
US2015069316(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
US201314021364 |
申请日期 |
2013.09.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LEE PO-HAO;CHOU CHUNG-CHENG;CHU WEN-TING |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor structure, comprising:
a conductive layer; a resistance configurable structure over the conductive layer, the resistance configurable structure comprising:
a first electrode comprising a first sidewall, a second sidewall, and a bottom surface on the conductive layer, wherein a joint between the first sidewall and the second sidewall includes an electric field enhancement structure;a resistance configurable layer over the first electrode; anda second electrode over the resistance configurable layer. |
地址 |
HSINCHU TW |