发明名称 RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
摘要 One embodiment in the present disclosure provides a resistor in a resistive random access memory (RRAM). The resistor includes a first electrode; a resistive layer on the first electrode; an electric field enhancement array in the resistive layer; and a second electrode on the resistive layer. The electric field enhancement array includes a plurality of electric field enhancers arranged in a same plane. One embodiment in the present disclosure provides a method of manufacturing a resistor structure in an RRAM. The method comprises (1) forming a first resistive layer on a first electrode; (2) forming a metal layer on the resistive layer; (3) patterning the metal layer to form a metal dot array on the resistive layer; and (4) forming a second electrode on the metal dot array. The metal dot array comprises a plurality of metal dots, and a distance between adjacent metal dots is less than 40 nm.
申请公布号 US2015069315(A1) 申请公布日期 2015.03.12
申请号 US201314019857 申请日期 2013.09.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. 发明人 SHIH SHENG-HUNG;CHU WEN-TING;TU KUO-CHI;LIAO YU-WEN;CHANG CHIH-YANG;YANG CHIN-CHIEH;CHEN HSIA-WEI;YOU WEN-CHUN;CHEN CHIH-MING
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A resistor in a resistive random access memory (RRAM), comprising: a first electrode; a resistive layer on the first electrode; an electric field enhancement array in the resistive layer; and a second electrode on the resistive layer; wherein the electric field enhancement array comprises a plurality of electric field enhancers arranged in a same plane, and wherein the electric field enhancer comprises at least a bent connecting two of a plurality of surfaces forming the electric field enhancer at a predetermined position, the bent having an angle of about or greater than 90 degrees.
地址 Hsinchu TW