ANNEAL MODULE FOR SEMICONDUCTOR WAFERS

摘要

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

主权项

1. An anneal apparatus comprising:
a metal body; a lid on the metal body with a process chamber formed between the metal body and the lid; one or more cooling lines in or on the metal body; a hot plate having a pedestal supported on a thermal choke on the body; a gas distributor in the lid over the hot plate; a cold plate on the metal body; a load slot in the metal body adjacent to the cold plate; a transfer mechanism having a hoop movable to a first position over the cold plate and to a second position over the hot plate, with the transfer mechanism also having a lifter for lifting and lowering the hoop; and at least one electronic assembly attached to the metal body.