发明名称 Solder Powder
摘要 The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results.
申请公布号 US2015068713(A1) 申请公布日期 2015.03.12
申请号 US201314388324 申请日期 2013.03.20
申请人 Erbslöh Aluminium GmbH 发明人 Sucke Norbert William;Löchte Lothar;Grzesik Martin
分类号 B23K35/02;F28D7/16;F28F21/08;B23K35/28 主分类号 B23K35/02
代理机构 代理人
主权项
地址 Velbert DE