THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING PLATING-LAYER-EQUIPPED RESIN MOLDED ARTICLE

摘要

Provided is a thermoplastic resin composition capable of providing a resin molded article which has high solder heat resistance, exhibits excellent plating properties, and has high reflectivity, high thermal conductivity, and high volume resistivity. The thermoplastic resin composition contains: (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point of 250°C or higher when measured by differential scanning calorimetry (DSC) at a rate of temperature increase of 10°C/min; (B) 40-150 parts by weight of an insulative heat-conducting filler which exhibits a thermal conductivity of 10W/m·K or higher; (C) 3-20 parts by weight of a laser-direct structuring additive; and (D) 10-130 parts by weight of titanium oxide. Furthermore, the total amount of the (B) insulative heat-conducting filler, the (C) laser-direct structuring additive, and the (D) titanium oxide constitutes 40-65 wt% of the resin composition.