| 摘要 |
<p>A method for manufacturing a semiconductor device, which comprises: a step A for preparing a laminate that has a sheet for temporary fixation, a semiconductor chip that is temporarily fixed on the sheet for temporary fixation, and a wall part that protrudes upward from the surface of the sheet for temporary fixation so as to surround a temporary fixation region in which the semiconductor chip is temporarily fixed; a step B for preparing a sheet for sealing, which has a shape that fits inside a sealing region when viewed in plan, said sealing region being surrounded by the wall part; and a step C for embedding the semiconductor chip into the sheet for sealing within the sealing region and forming a package in which the semiconductor chip is embedded in the sheet for sealing.</p> |
