BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY

摘要

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached, and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold. Other embodiments are also disclosed and claimed.

主权项

1. A method comprising:
receiving a coreless substrate strip; and forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached; and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold.