发明名称 Method For Forming Photo-Mask And OPC Method
摘要 A method for forming a photo-mask is provided. A first photo-mask pattern relating to a first line, an original second photo-mask pattern relating to a first via plug, and a third photo-mask pattern relating to a second line are provided. A first optical proximity correction (OPC) process is performed. A second OPC process is performed, comprising enlarging a width of the second photo-mask pattern along the first direction to form a revised second photo-resist pattern. A contour simulation process is performed to make sure the revised second photo-mask pattern is larger or equal to the original second-mask pattern. The first photo-mask pattern, the revised second photo-mask pattern, and the third photo-mask pattern are output. The present invention further provides an OPC method.
申请公布号 US2015072272(A1) 申请公布日期 2015.03.12
申请号 US201314023476 申请日期 2013.09.11
申请人 UNITED MICROELECTRONICS CORP. 发明人 Huang Chun-Hsien;Chen Ming-Jui;Huang Chia-Wei;Chen Hsin-Yu;Chuang Kai-Lin
分类号 G03F1/72;G03F1/00 主分类号 G03F1/72
代理机构 代理人
主权项 1. A method for forming a photo-mask, comprising: providing a first photo-mask pattern relating to a first line, an original second photo-mask pattern relating to a first via plug, and a third photo-mask pattern relating to a second line, wherein the first metal line, the first via plug and the second line are disposed in sequence in a semiconductor structure, and the first line extends along a first direction, the second line extends along a second direction, the first via plug is disposed at the intersection of the first line and the second line; performing a first optical proximity correction (OPC) process by using a computer, comprising a comparing step and/or a modification step for the original second photo-mask pattern; performing a second OPC process, comprising enlarging a width of original the second photo-mask pattern along the first direction, wherein after the first OPC process and the second OPC process, the original the second photo-mask pattern becomes a revised second photo-resist pattern; after the second OPC process, performing a contour simulation process to make sure the revised second photo-mask pattern is larger or equal to the original second-mask pattern; and outputting the first photo-mask pattern to form a first photo-mask, outputting the revised second photo-mask pattern to form a second photo-mask, and outputting the third photo-mask pattern to form a third photo-mask.
地址 Hsin-Chu City TW