发明名称 METHODS FOR FORMING CHIP-SCALE ELECTRICAL COMPONENTS
摘要 A method of forming a planar, low loss electrical component such as an inductor or transmission line is provided. A channel can be formed on a top surface of a substrate. A threading plate can be positioned on an upper surface of the channel. A wire or fiber can be introduced through the substrate, the channel, and the threading plate. The wire or fiber can then be guided into the channel using the threading plate. The substrate and the threading plate can then be removed.
申请公布号 US2015070123(A1) 申请公布日期 2015.03.12
申请号 US201414482874 申请日期 2014.09.10
申请人 The Charles Stark Draper Laboratory, Inc. 发明人 Duwel Amy;Nation Joshua;Fiering Jason O.;White Doug
分类号 H01F27/28;H01F41/04;H01B13/06;H01F27/29 主分类号 H01F27/28
代理机构 代理人
主权项 1. A method of fabricating an electronic component, the method comprising: obtaining a component substrate; forming a pattern including a channel on an upper surface of the component substrate; positioning a movable threading plate on an upper surface of the pattern; introducing a wire or fiber having a diameter less than or equal to about 200 microns through the threading plate; and guiding the wire or fiber into the channel using the threading plate;
地址 Cambridge MA US