| 摘要 |
Disclosed is a hot runner system including a thermal expansion compensation device. The hot runner system including a thermal expansion compensation device, according to the present invention, compensates for the dislocation of a joint between a manifold and a resin due to thermal expansion of the manifold heated by a heating wire at a high temperature so as to prevent the leakage of the resin resulting from a gap formed therebetween and to appropriately maintain the flowability of the resin. Thus, high reliability can be secured according to the arrangement of the simplified structure between the manifold and nozzles. |
