| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a starting point for generating cracks at a groove bottom of a cutting blade, and divide a wafer at a proper position along a formation position of the starting point.SOLUTION: A cutting blade (38) has an annular-shaped cutting blade (48) for cutting a wafer (W). A cross sectional shape on a tip side of the cutting blade is formed into a single blade shape by one face (48a) parallel to a face orthogonal to a rotation center shaft (C) and the other face (48b) directed to a direction inclined to one face from a peak point (48c) that is a tip on one face. The cutting blade is cut to a middle in a thickness direction of the wafer from a wafer surface side. Therefore, after a step of forming a cutting groove (M) inclined to the wafer surface by the groove bottom (Ma), an external force is given to the wafer to generate cracks (K) with a peak point (Mb) on a wafer rear face side at the groove bottom to divide the wafer into individual chips.</p> |
