| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which strength of a resin layer covering an external electrode in solder mounting is improved.SOLUTION: A ceramic electronic component includes an element body 2; an external electrode 4 which integrally covers the element body 2 at an end surface side of the element body 2; and an insulation resin coating layer 21 which covers the surface other than an electrode portion of the external electrode 4, in which the insulation resin coating layer 21 has a slit 22 extending in a direction orthogonal to a principal surface (Z direction). In this ceramic electronic component, the slit 22 of the insulation resin coating layer 21 houses at least a part of a solder 30 when the solder 30 rises, between the insulation resin coating layer 21 and the external electrode 4. Therefore, stress which is a force of pressing generated by the solder 30 from inside of the insulation resin coating layer 21 is reduced, as a result, strength of the insulation resin coating layer 21 is improved.</p> |
