发明名称 CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
摘要 A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
申请公布号 US2015070851(A1) 申请公布日期 2015.03.12
申请号 US201314090534 申请日期 2013.11.26
申请人 Taiyo Yuden Co., Ltd. 发明人 KITAZAKI Kenzo;SHIMAMURA Masaya;MUGIYA Eiji;KAI Takehiko
分类号 H05K9/00;H05K3/30 主分类号 H05K9/00
代理机构 代理人
主权项 1. A circuit module, comprising: a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having a first area and a second area, the conductor pattern being formed along a boundary between the first area and the second area on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first area and the second area; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having a first shield portion and a second shield portion, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
地址 Tokyo JP