发明名称 WAFER-BASED LIGHT SOURCE PARAMETER CONTROL
摘要 A photolithography method includes instructing an optical source to produce a pulsed light beam; scanning the pulsed light beam across a wafer of a lithography exposure apparatus to expose the wafer with the pulsed light beam; during scanning of the pulsed light beam across the wafer, receiving a characteristic of the pulsed light beam at the wafer; receiving a determined value of a physical property of a wafer for a particular pulsed light beam characteristic; and based on the pulsed light beam characteristic that is received during scanning and the received determined value of the physical property, modifying a performance parameter of the pulsed light beam during scanning across the wafer.
申请公布号 US2015070673(A1) 申请公布日期 2015.03.12
申请号 US201414295558 申请日期 2014.06.04
申请人 Cymer, LLC 发明人 Lalovic Ivan;Zurita Omar;Rechtsteiner Gregory Allen;Alagna Paolo;Hsieh Simon;Lee Jason J.;Rokitski Rostislav;Jiang Rui
分类号 G03F7/20 主分类号 G03F7/20
代理机构 代理人
主权项 1. A photolithography method comprising: instructing an optical source to produce a pulsed light beam; scanning the pulsed light beam across a wafer of a lithography exposure apparatus to expose the wafer with the pulsed light beam; during scanning of the pulsed light beam across the wafer, receiving a characteristic of the pulsed light beam at the wafer; receiving a determined value of a physical property of a wafer for a particular pulsed light beam characteristic; and based on the pulsed light beam characteristic that is received during scanning and the received determined value of the physical property, modifying a performance parameter of the pulsed light beam during scanning across the wafer.
地址 San Diego CA US