| 发明名称 |
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND APPLICATION BOARD MOUNTED WITH SAME |
| 摘要 |
In one embodiment, a semiconductor device includes a lead frame including an island portion and a terminal portion separated from the island portion. The device further includes a semiconductor chip mounted on the island portion and including an electrode. The device further includes an insulating layer disposed on the semiconductor chip and having an opening to expose at least a part of the electrode. The device further includes a connector covering the electrode exposed through the opening and electrically connecting the electrode and the terminal portion. |
| 申请公布号 |
US2015069592(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414199515 |
申请日期 |
2014.03.06 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Tamura Koji;Sato Nobuyuki;Shingai Nobuhiro;Ozawa Shinya;Matsuoka Takeru;Okumura Hideki |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a lead frame including an island portion and a terminal portion separated from the island portion; a semiconductor chip mounted on the island portion and including an electrode; an insulating layer disposed on the semiconductor chip and having an opening to expose at least a part of the electrode; and a connector covering the electrode exposed through the opening and electrically connecting the electrode and the terminal portion. |
| 地址 |
Tokyo JP |
