发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
摘要 |
A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air. |
申请公布号 |
US2015069454(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
US201414543785 |
申请日期 |
2014.11.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK Na-Na;PARK Il Woo;KWAK Chang Hoon |
分类号 |
H01L33/50;H01L33/62;H01L33/60 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Seoul KR |