发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.
申请公布号 US2015069454(A1) 申请公布日期 2015.03.12
申请号 US201414543785 申请日期 2014.11.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK Na-Na;PARK Il Woo;KWAK Chang Hoon
分类号 H01L33/50;H01L33/62;H01L33/60 主分类号 H01L33/50
代理机构 代理人
主权项
地址 Seoul KR