WAFER TO WAFER ALIGNMENT BY LED/LSD DEVICES

摘要

A method for wafer alignment includes forming a first alignment circuit within a first semiconductor wafer; the first alignment circuit is configured to emit an optical signal. Next, the first alignment circuit is activated upon receiving a first activation signal from a wafer bonding tool then the optical signal is sent to a second alignment circuit in a second semiconductor wafer in overlapping relation to the first semiconductor wafer. The second alignment circuit transmits a second activation signal to the wafer bonding tool and consequently the wafer bonding tool initiates an alignment technique between the first and second semiconductor wafers. The alignment technique uses the first and second alignment circuits for optical alignment.

主权项

1. A method for wafer alignment, comprising:
forming a first alignment circuit within a first semiconductor wafer, the first alignment circuit configured to emit an optical signal; activating the first alignment circuit upon receiving a first activation signal from a wafer bonding tool; sending the optical signal to a second alignment circuit in a second semiconductor wafer in overlapping relation to the first semiconductor wafer, the second alignment circuit transmitting a second activation signal to the wafer bonding tool; and the wafer bonding tool initiating an alignment technique between the first and second semiconductor wafers, the alignment technique using the first and second alignment circuit for optical alignment.