发明名称 MULTI-LAYER MICRO-WIRE SUBSTRATE METHOD
摘要 A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.
申请公布号 US2015068032(A1) 申请公布日期 2015.03.12
申请号 US201314023757 申请日期 2013.09.11
申请人 Cok Ronald Steven 发明人 Cok Ronald Steven
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项 1. A method of making a multi-layer micro-wire structure, comprising: providing a substrate having a substrate edge; forming a first layer over the substrate extending to a first layer edge; imprinting one or more first micro-channels in the first layer; locating a first micro-wire in at least one imprinted first micro-channel, the first micro-wire forming at least a portion of an exposed first connection pad in the first layer; forming a second layer over the first layer extending to a second layer edge; imprinting one or more second micro-channels in the second layer; locating a second micro-wire in at least one imprinted second micro-channel, the second micro-wire forming at least a portion of an exposed second connection pad in the second layer; and wherein the second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.
地址 Rochester NY US