发明名称 |
MULTI-LAYER MICRO-WIRE SUBSTRATE METHOD |
摘要 |
A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer. |
申请公布号 |
US2015068032(A1) |
申请公布日期 |
2015.03.12 |
申请号 |
US201314023757 |
申请日期 |
2013.09.11 |
申请人 |
Cok Ronald Steven |
发明人 |
Cok Ronald Steven |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
1. A method of making a multi-layer micro-wire structure, comprising:
providing a substrate having a substrate edge; forming a first layer over the substrate extending to a first layer edge; imprinting one or more first micro-channels in the first layer; locating a first micro-wire in at least one imprinted first micro-channel, the first micro-wire forming at least a portion of an exposed first connection pad in the first layer; forming a second layer over the first layer extending to a second layer edge; imprinting one or more second micro-channels in the second layer; locating a second micro-wire in at least one imprinted second micro-channel, the second micro-wire forming at least a portion of an exposed second connection pad in the second layer; and wherein the second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer. |
地址 |
Rochester NY US |