发明名称 |
Laserdiodenvorrichtung |
摘要 |
A laser diode device has a housing with a mounting part and a laser diode chip, which is based on a nitride compound semi-conductor material, in the housing on the mounting part. The laser diode chip is mounted directly on the mounting part by means of a solder layer and the solder layer has a thickness of greater than or equal to 3 μm. |
申请公布号 |
DE112013001987(A5) |
申请公布日期 |
2015.03.12 |
申请号 |
DE20131101987T |
申请日期 |
2013.03.11 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
STRAUSS, UWE;TAUTZ, SÖNKE;LELL, ALFRED;VIERHEILIG, CLEMENS |
分类号 |
H01S5/022;H01S5/024;H01S5/323 |
主分类号 |
H01S5/022 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|